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US 12,509,768 B2Granted
Method of manufacturing semiconductor device, substrate processing apparatus and evaporation system
AssigneeKokusai Electric Corporation
InventorsKosuke Takagi, Yuji Takebayashi
Life of this patent
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Abstract
An amount of particles generated when a source material is used is suppressed. A substrate is loaded into a process chamber, and the source material is sequentially flowed into an evaporator, and a mist filter constituted by assembling a plurality of at least two types of plates including holes disposed at different positions to be evaporated and supplied into the process chamber to process the substrate, and then, the substrate is unloaded from the process chamber.
Claims20
A substrate processing method, comprising:
- (a) supplying a source material comprising a metal to an evaporator, and generating a gas and a mist from the source material by evaporating the source material;
- (b) supplying the gas and the mist to a mist filter to convert the mist into a gaseous state, wherein the mist filter is installed separately from the evaporator and a gas pipe heated by the evaporator and a first heater is interposed between the mist filter and the evaporator, the mist filter comprising:
- a second heater, and
- a stacked structure a stacked structure formed by a plurality of first plates and a plurality of second plates being alternately engaged with each other at outer circumferential sections thereof,
- wherein each of the plurality of first plates comprise a first plate section provided with a first hole and a first outer circumferential section disposed at a position offset with respect to the first plate section, and the first plate section and the first outer circumferential section are integrated as a single body,
- wherein each of the plurality of second plates comprise a second plate section provided with a second hole disposed at a position different from that of the first hole and a second outer circumferential section disposed at a position offset with respect to the second plate section, and the second plate section and the second outer circumferential section are integrated as a single body, and
- wherein a length of the cylindrical stacked structure measured along a stacking direction is greater than an outer diameter thereof;
- (c) supplying the gas from the mist filter into a gas filter to collect a particle generated in at least one of the evaporator or the mist filter;
- (d) supplying the gas from the gas filter to a process chamber to form a layer comprising the metal on a substrate;
- and
- (e) after performing (a) and before performing (b), allowing the mist to flow through the gas pipe such that a flow velocity of the mist increases from an outlet side of the evaporator through the gas pipe toward the mist filter during a fore flow period in which the source material passes through the gas pipe,
- wherein the mist filter is provided between a flow rate controller installed at the gas pipe and the evaporator, and
- wherein during the fore flow period the flow rate controller controls the flow velocity of the mist through the gas pipe.
10 more elements
Dependencies are inferred from the claim text.