Thermal interface materials

Abstract

Thermally conductive compositions include a blocked isocyanate prepolymer composition containing an isocyanate prepolymer blocked with one or more of alkylphenol or alkenylphenol; and an amine composition containing: one or more polyetheramines, and one or more catalysts selected from a group consisting of carboxy late salts, tertiary amines, amidines, guanidines, and diazabicyclo compounds; and a thermally conductive filler present at a percent by weight of the thermally conductive composition (wt %) in a range of 60 wt % to 98 wt %; wherein the thermally conductive composition cures at a temperature in the range of 18° C. to 35° C. when the blocked isocyanate prepolymer composition and the amine composition are mixed. Methods include preparing a thermally conductive gap filler prepared by combining a blocked isocyanate prepolymer composition and an amine composition, and curing the resulting thermally conductive composition, such as at room temperature.

Dependencies are inferred from the claim text.