Substrate-conveying support tape and electronic apparatus/device production method

A substrate-conveying support tape comprising:

• a support film;
• a primer layer provided on the support film;
• and
• a temporary fixing material layer provided on the primer layer, wherein
• the support film is a polyimide film,
• the temporary fixing material layer comprises a thermoplastic resin, and
• the primer layer consists of at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more, wherein, when a laminate which is formed by affixing the substrate-conveying support tape to a substrate having a mean surface provided with a solder resist so that the temporary fixing material layer is in contact with the main surface of the substrate and which comprises the substrate, the temporary fixing material layer, the primer layer, and the support film in this order, is heated for 30 minutes at 130° C. for 1 hour at 170° C. and for 5 min at 260° C., a 90° peel strength at 25° C. between the temporary fixing material layer and the support film in the laminate is larger than a 90° peel strength at 25° C. between the substrate and the temporary fixing material layer in the laminate.