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US 12,509,562 B2Granted
Epoxy resin compositions and downhole uses thereof
AssigneeWestlake Chemical Corporation
InventorsMatthew Sumpter, Ervin Mubarekyan, Mingbo He
Life of this patent
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Abstract
Embodiments of the present disclosure generally relate to epoxy resin compositions and uses thereof. In some embodiments, a method includes providing an emulsion to a wellbore. The emulsion comprises an epoxy resin, a curing agent, water, and a block copolymer surfactant. The method includes de-emulsifying the emulsion in the wellbore to form a water phase and an epoxy phase and applying the epoxy phase to a wellbore component. The method includes curing the epoxy phase in the aperture after de-emulsifying the emulsion.
Claims20
A method comprising:
- providing an emulsion to a wellbore, the emulsion comprising:
- an epoxy resin,
- a curing agent,
- a temperature responsive surfactant comprising a block copolymer having at least one hydrophilic block and at least one hydrophobic block;
- and
- water;
- de-emulsifying the emulsion in the wellbore at a temperature of about 35° C. to about 100° C., forming a water phase and an epoxy phase;
- applying the epoxy phase to a wellbore component;
- and
- curing the epoxy phase at the wellbore component after de-emulsifying the emulsion.
7 more elements
Dependencies are inferred from the claim text.