Substrate processing station for laser-based machining of sheet-like glass substrates

A method for laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which a laser beam of a laser for machining the substrate is directed onto the substrate, the method comprising:

• processing the sheet-like substrate using a first gantry assembly that extends across the sheet-like substrate in a cross-machine direction, the first gantry assembly comprising a first processing head and a second processing head, which move along a length of the first gantry assembly, and comprising a laser that provides a laser beam,
• the laser comprising an optical arrangement that is positioned in a beam path of the laser beam and that splits the laser beam into a first laser beam provided to the first processing head and a second laser beam provided to the second processing head, the first laser beam and the second laser beam each providing a laser beam focal line that is formed on a beam output side of the optical arrangement,
• the optical arrangement comprising a first focusing optical element and a second focusing optical element spaced apart from the first focusing optical element, the first focusing optical element and the second focusing optical element generating the laser beam focal line, of the first laser beam and of the second laser beam, on a beam output side of the second focusing optical element, and
• the optical arrangement further comprising a third focusing optical element positioned between the first focusing optical element and the second focusing optical element along the beam path of the laser beam;
• and
• processing the sheet-like substrate using a second gantry assembly that extends across the sheet-like substrate in the cross-machine direction, the second gantry assembly comprising a third processing head that moves along a length of the second gantry assembly.