Deposition mask package and deposition mask packaging method
AssigneeDai Nippon Printing Co., Ltd.
InventorsChikao Ikenaga, Takumi Oike, Tsukasa Mukaida, Takeru Watanabe
Life of this patent
Estimating the term…
Abstract
A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.
Claims8
A deposition mask packaging method for packaging a deposition mask, which includes a first surface, a second surface positioned opposite to the first surface, and a plurality of through-holes extending from the first surface to the second surface, the deposition mask packaging method comprising:
- obtaining a deposition mask stacked body having the deposition mask and an interposed sheet stacked on each of the first surface and the second surface of the deposition mask, the deposition mask stacked body placed on a receiving portion;
- arranging a lid portion on the deposition mask stacked body such that the receiving portion and the lid portion face each other;
- and
- sandwiching the deposition mask stacked body between the receiving portion and the lid portion,
- wherein a difference between a thermal expansion coefficient of the deposition mask and a thermal expansion coefficient of the interposed sheets is 7 ppm/° C. or less, and
- wherein each interposed sheet is formed in a flat shape comprising no holes.
Dependencies are inferred from the claim text.