Methods, apparatuses, and systems for edge sealing laminate wafers containing a soft deformable inner film

A system for forming an optical wafer, the system comprising:

• an imprinting apparatus configured to imprint an outline of the optical wafer on a laminate sheet, the imprinting apparatus comprising:
• a sealing band configured to heat and compress an edge portion of the optical wafer, and
• a cutting apparatus configured to cut the optical wafer from the laminate sheet,
• wherein the sealing band comprises a tool comprising:
• a first insert comprising a first inner surface configured to contact a first surface of the optical wafer,
• the first inner surface defining a first opening of a first cavity configured to receive a first portion of the optical wafer, and
• a second insert comprising a second inner surface configured to contact a second surface of the optical wafer, the second inner surface defining a second opening of a second cavity configured to receive a second portion of the optical wafer,
• wherein, during a sealing operation, the first insert and the second insert are configured to:
• apply one or more of heat and pressure to the optical wafer, and
• reduce a thickness of a layer of the optical wafer positioned between the first inner surface of the first insert and the second inner surface of the second insert.