Wafer cleaning apparatus

A wafer cleaning apparatus comprising:

• a wafer roller configured to rotate a wafer around a first direction, wherein the wafer includes a first surface and a second surface that is an opposite surface of the first surface, and the first direction is parallel to a normal direction of the first surface of the wafer;
• a first brush and a second brush disposed side by side in a horizontal direction with respect to a floor on which the wafer cleaning apparatus is installed, wherein the horizontal direction is parallel to the first direction, wherein the first surface and the second surface of the wafer are disposed between the first and second brushes, and wherein the first and second surfaces of the wafer face the first and second brushes, respectively;
• a first cleaning tank disposed below the first brush, and movable to accommodate at least a portion of the first brush;
• and
• a second cleaning tank disposed below the second brush, and movable to accommodate at least a portion of the second brush,
• wherein each of the first cleaning tank and the second cleaning tank comprises:
• a first side surface and a second side surface extending in a same direction as an extension direction of each of the first cleaning tank and the second cleaning tank;
• a third side surface and a fourth side surface crossing each of the first side surface and the second side surface;
• at least one solution injection member disposed on at least one of the first side surface, the second side surface, the third side surface, and the fourth side surface, wherein each of the at least one solution injection member includes a bubble generating filter having a plurality of through-holes;
• a first main heating member contacting the first side surface;
• and
• a second main heating member contacting the second side surface.

A wafer cleaning apparatus comprising:

• a wafer roller configured to rotate a wafer around a first direction, wherein the wafer includes a first surface and a second surface that is an opposite surface of the first surface, and the first direction is parallel to a normal direction of the first surface of the wafer;
• a first brush facing the first surface of the wafer;
• a second brush facing the second surface of the wafer, and disposed under the first brush in a vertical direction with respect to a floor on which the wafer cleaning apparatus is installed, wherein the vertical direction is parallel to the first direction;
• a first cleaning tank disposed below the second brush in the vertical direction, and accommodating at least a portion of the second brush;
• and
• a second cleaning tank disposed side by side to the first cleaning tank in a horizontal direction with respect to the floor, and movable to accommodate at least a portion of the first brush,
• wherein each of the first cleaning tank and the second cleaning tank comprises:
• a main heating member disposed on a first side surface of the first cleaning tank and a first side surface of the second cleaning tank;
• and
• a solution injection member disposed on a second side surface of the first cleaning tank and a second side surface of the second cleaning tank, and
• wherein the solution injection member comprises:
• a bubble generating filter having a plurality of through-holes;
• a first sub-heating member surrounding a side surface of the bubble generating filter;
• and
• a second sub-heating member extending from a central portion of the bubble generating filter toward the side surface of the bubble generating filter.