Photosensor

A photosensor, comprising:

• a substrate;
• a first conductive layer, disposed on a main surface of the substrate;
• a second conductive layer, disposed on a back surface of the substrate;
• a conductive via layer, disposed between the first conductive layer and the second conductive layer;
• a light emitting element, mounted on the first conductive layer;
• an integrated circuit (IC), mounted on the first conductive layer and including a light receiving element;
• and
• a covering member being translucent, disposed on the substrate, covering the light emitting element and the IC together with the first conductive layer, and including a groove between the light emitting element and the IC in a plan view of the substrate wherein
• the first conductive layer includes:
• a first mounting portion, on which the light emitting element is mounted;
• and
• a second mounting portion, on which the IC is mounted, and
• the light emitting element is electrically connected to the IC through the first mounting portion, the conductive via layer, the second conductive layer and the second mounting portion,
• wherein the conductive via layer penetrates the substrate.

A photosensor, comprising:

• a substrate;
• a first conductive layer, disposed on a main surface of the substrate;
• a second conductive layer, disposed on a back surface of the substrate;
• a conductive via layer, disposed between the first conductive layer and the second conductive layer;
• a light emitting element, mounted on the first conductive layer;
• an integrated circuit (IC), mounted on the first conductive layer and including a light receiving element;
• and
• a covering member being translucent, disposed on the substrate, covering the light emitting element and the IC together with the first conductive layer, and including a groove between the light emitting element and the IC in a plan view of the substrate, wherein
• the first conductive layer includes:
• a first mounting portion, on which the light emitting element is mounted;
• and
• a second mounting portion, on which the IC is mounted, and
• the light emitting element is electrically connected to the IC through the first mounting portion, the conductive via layer, the second conductive layer and the second mounting portion,
• wherein the light emitting element is a vertical cavity surface emitting laser, and the light receiving element is a photodiode.