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US 12,507,454 B2Granted
Method for fabricating wafer scale/nano submicron gap electrodes and arrays via photolithography
AssigneeWayne State University
InventorsLeela Mohana Reddy Arava, Nirul Masurkar
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Abstract
A electronic device and a fabrication method is provided. The electronic device having a first electrode and a second electrode. A nano-gap is formed between first and second electrode. The first electrode, the second electrode and the gap may be located in the same layer of the device. A two-dimensional layer of graphene may cover the gap.
Claims20
A method for generating an electronic device, the method comprising the steps of:
- patterning a first electrode on a substrate by metallization;
- forming an oxide layer on the first electrode which overhangs the first electrode onto a sacrificial layer that is adjacent to the first electrode and on top of the substrate;
- patterning a second electrode on the substrate and adjacent to the sacrificial layer by metallization such that the sacrificial layer is between the first electrode and the second electrode;
- and
- removing the oxide layer and the sacrificial layer, wherein the oxide layer overhanging the first electrode onto the sacrificial layer causes a gap to form between the first and second electrode when the sacrificial layer between the first and second electrode is removed, wherein the gap is a sub-micron gap.
2 more elements
A method of fabricating an electronic device, comprising:
- patterning a first electrode on a substrate by metallization;
- patterning a second electrode on the substrate by metallization;
- depositing a sacrificial layer on the substrate;
- forming an expansion layer on the first electrode with a portion of the expansion layer overhanging the first electrode onto a portion of the sacrificial layer that is adjacent to the first electrode;
- and
- removing the expansion layer and the sacrificial layer, wherein a nano-gap is formed between the first electrode and the second electrode when the portion of the sacrificial layer between the first electrode and the second electrode is removed.
3 more elements
A method comprising:
- depositing a sacrificial layer on a substrate;
- depositing a photoresist layer on the sacrificial layer;
- removing portions of the photoresist layer and portions of the sacrificial layer;
- patterning a first electrode on the substrate by metallization such that the first electrode fills a space left by one of the removed portions of the sacrificial layer;
- forming an expansion layer on the first electrode such that the expansion layer expands onto a remaining portion of the sacrificial layer adjacent to the first electrode;
- patterning, by metallization, a second electrode on the substrate adjacent to the remaining portion of the sacrificial layer such that the remaining portion of the sacrificial layer is between the first electrode and the second electrode;
- and
- removing the expansion layer and the remaining portion of the sacrificial layer, wherein a nano-gap is formed between the first electrode and the second electrode when the remaining portion of sacrificial layer is removed.
5 more elements
Dependencies are inferred from the claim text.