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US 12,506,922 B2Granted
Magnetic connector attachment and heat sinking
AssigneeDISH Network L.L.C.
InventorSteven Nedved
Life of this patent
Estimating the term…
Abstract
A co-processor module for use with a set top box including an enclosure and a processor assembly contained in the enclosure. The processor assembly can include a PCB, a processor, and a USB connector. One or more magnets extend through a wall of the enclosure and are positioned to contact a surface of the set top box when the USB connector is connected to the set top box.
Claims20
A co-processor module for use with a device, the module comprising:
- an enclosure;
- a processor assembly contained in the enclosure and comprising a processor and a connector;
- one or more magnets extending through a wall of the enclosure and positioned to directly contact a surface of the device when the connector is connected to the device;
- a metal plate in direct contact with the one or more magnets;
- and
- a thermal pad in thermal contact with the processor and the metal plate.
3 more elements
A co-processor module for use with a device, the module comprising:
- an enclosure having a first half and a second half;
- a processor assembly contained in the enclosure and including a PCB, a processor, and a connector;
- one or more magnets extending through the first half and positioned to directly contact a surface of the device when the connector is connected to the device;
- a first metal plate attached to the first half, wherein the one or more magnets are in direct contact with the first metal plate;
- and
- a first thermal pad in thermal contact with the processor and the first metal plate;
- and
- a second thermal pad positioned against the PCB and a second metal plate positioned against the second thermal pad.
5 more elements
A method for supplementing the processing capability of a device, the method comprising:
- connecting a module to the device via a connector, the module comprising an enclosure and a processing device;
- retaining the module against a surface of the device with one or more magnets that extend through a wall of the enclosure and are positioned in direct contact with the surface;
- and
- transferring heat from the processing device to the surface of the device via a metal plate in direct contact with the one or more magnets, wherein the metal plate is in thermal contact with the processing device and the metal plate.
1 more element
Dependencies are inferred from the claim text.