Sensor package

A sensor packaging method, comprising:

• providing a substrate having an upper board surface and a lower board surface, wherein the upper board surface has a die-bonding region, and the substrate includes:
• a core material layer;
• an upper metal layer disposed on the core material layer;
• and
• an upper protection layer disposed on the upper metal layer, wherein a first window is formed to penetrate the upper protection layer and located at a periphery of the die-bonding region, and the first window is opened for a first ground electrode that is electrically connected to a first ground portion of the upper metal layer;
• performing a dispensing step to apply an adhesive material on the upper board surface in at least a portion of the die-bonding region;
• and
• attaching a sensor die to the substrate through the adhesive material, wherein the sensor die is disposed in the die-bonding region and has a first ground pin electrically connected to the first ground electrode.