Interposer device and semiconductor package structure

A semiconductor package structure, comprising:

• two semiconductor devices;
• and
• an interposer device, coupled between the two semiconductor devices and configured to transmit a plurality of circuit signals between the two semiconductor devices, comprising:
• two first bump regions, respectively coupled to the two semiconductor devices;
• a first channel region, connected between the two first bump regions;
• a plurality of first signal lines, embedded in the two first bump regions and the first channel region, and electrically connected to the two semiconductor devices for transmitting the plurality of circuit signals;
• and
• a plurality of first ground lines, embedded in the two first bump regions and the first channel region for shielding the plurality of first signal lines,
• wherein in each of the two first bump regions, each of the plurality of first signal lines comprises a signal turning point, a trunk portion and a turning portion, wherein the signal turning point of each of the plurality of first signal lines is connected between the trunk portion and the turning portion of a corresponding one of the plurality of first signal lines, the trunk portion of each of the plurality of first signal lines extends parallel to a first direction, and the turning portion of each of the plurality of first signal lines extends parallel to a second direction, so that when the interposer device is viewed parallel to a third direction, each of the plurality of first signal lines in each of the two first bump regions is L-shaped, wherein the third direction is substantially perpendicular to the first direction and the second direction,
• wherein each of the two first bump regions comprises a plurality of vias coupled to the plurality of first signal lines and arranged parallel to the first direction, and
• wherein each of the plurality of vias is connected to an end of the turning portion of each of the plurality of first signal lines.