US 12,504,644 B2Granted

3D integrated imaging devices and preparation methods thereof

AssigneeSvg Tech Group Co., Ltd.

InventorsMing Zhu, Ying Yang, Guoyong Zhang, Shunda Xu, Renjin Shao, Donglin Pu, Xiaoning Liu

Life of this patent

Estimating the term…

Loading patent…

Abstract

The present disclosure relates to a 3D integrated imaging device and a preparation method thereof. The 3D integrated imaging device includes a spacer layer, a three-dimensional structure layer, and a microlens array. The spacer layer has a preset thickness. The three-dimensional structure layer is disposed on a surface of a side of the spacer layer and includes a plurality of micro-nano structure units. The microlens array is arranged on a surface of a side of the spacer layer away from the three-dimensional structure layer and includes a plurality of microlenses. The plurality of micro-nano structure units correspond to the plurality of micro-lenses one by one. A front view pattern of the plurality of micro-nano structure units is a superposition of images formed by each layered image of a target stereoscopic image under the plurality of micro-lenses according to different depths of field after the target stereoscopic image is layered.

Claims11

Dependent claims

A 3D integrated imaging device, comprising:

a spacer layer having a preset thickness;
a three-dimensional structure layer disposed on a surface of a side of the spacer layer, the three-dimensional structure layer including a plurality of micro-nano structure units;
and
a microlens array arranged on a surface of a side of the spacer layer away from the three-dimensional structure layer, the microlens array including a plurality of microlenses,
wherein
the plurality of micro-nano structure units correspond to the plurality of microlenses one by one,
a front view pattern of the plurality of micro-nano structure units is a superposition of images formed by each layered image of a target stereoscopic image under the plurality of microlenses according to different depths of field after the target stereoscopic image is layered, and
a relationship between pixel coordinates of each layered image of the target stereoscopic image under a single microlens in a three-dimensional coordinate system and pixel coordinates in the three-dimensional structure layer is:
X
=
X
⁢
0
+
tan
⁡
(
sin
-
1
(
sin
⁡
(
tan
-
1
(
x
-
x
⁢
0
g
)
)
*
n
)
)
*
d
Y
=
Y
⁢
0
+
tan
⁡
(
sin
-
1
(
sin
⁡
(
tan
-
1
(
y
-
y
⁢
0
g
)
)
*
n
)
)
*
d
where (X, Y) refers to the pixel coordinates of the layered image of the target stereoscopic image in the three-dimensional coordinate system, (X0, Y0) refers to a central coordinate of the microlens, (x, y) refers to coordinates of pixel points on a micro-nano structure unit corresponding to the microlens, (x0, y0) refers to a central coordinate of the micro-nano structure unit, n is a refractive index of the microlens, g is a sum of a thickness of the spacer layer and a height of the microlens, and d is a depth of field, that is, a distance from a plane where the layered image is located to a vertex of the microlens.

74 more elements

A preparation method for a 3D integrated imaging device, wherein:

the 3D integrated imaging device comprises:
a spacer layer having a preset thickness;
a three-dimensional structure layer is disposed on a surface of a side of the spacer layer, the three-dimensional structure layer including a plurality of micro-nano structure units;
and
a microlens array arranged on a surface of a side of the spacer layer away from the three-dimensional structure layer, the microlens array including a plurality of microlenses,
wherein
the plurality of micro-nano structure units correspond to the plurality of micro-lenses one by one, and
a front view pattern of the plurality of micro-nano structure units is a superposition of images formed by each layered image of a target stereoscopic image under the plurality of micro-lenses according to different depths of field after the target stereoscopic image is layered,
the preparation method comprises:
simulating to form a three-dimensional coordinate system;
converting pixel coordinates of a three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on a recording plane;
forming the three-dimensional structure layer on a surface of a side of a substrate based on the pixel coordinates on the recording plane;
disposing the spacer layer on a surface of the three-dimensional structure layer away from the substrate;
and
disposing the microlens array on a surface of a side of the spacer layer away from the three-dimensional structure layer.

12 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/273,214Filed 18 Jul 2025 · continuation
Priority: CN 202310085843.57 Feb 2023
Published: US 2025/0347925 A113 Nov 2025
Granted: 23 Dec 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

G02B 30/36
Stereoscopes providing a stereoscopic pair of separated images corresponding to parallactically displaced views of the same object, e.g.…: using…
H04N 13/305
For viewing without the aid of special glasses, i.e. using autostereoscopic displays: using lenticular lenses, e.g. arrangements of cylindrical lenses
H04N 23/958
Computational photography systems, e.g. light-field imaging systems: for extended depth of field imaging
G02B
Optical elements, systems or apparatus