Optical wafer-level package
AssigneeCisco Technology, Inc.
InventorsNorbert Schlepple, Aparna R. Prasad, Vipulkumar K. Patel
Life of this patent
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Abstract
In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.
Claims32
An optical wafer-level package comprising:
- a frontside electrical redistribution layer (RDL);
- a molding compound layer, the optical wafer-level package further comprising at least one of:
- an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal;
- or
- an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal;
- and
- a backside electrical RDL electrically coupled on one end to the frontside electrical RDL by vias and on another end to a circuit substrate via solder, wherein at least one of the optical transmitter and the optical receiver is arranged between the frontside electrical RDL and the backside electrical RDL and wherein the backside electrical RDL is separated from the at least one of the optical transmitter and the optical receiver by the molding compound layer.
An optical assembly comprising:
- an optical waveguide;
- and
- an optical wafer-level package optically coupled to the optical waveguide, the optical wafer-level package comprising:
- a frontside electrical redistribution layer (RDL);
- a molding compound layer, the optical wafer-level package further comprising at least one of:
- an optical transmitter at least partially embedded within the molding compound layer, optically coupled to the optical waveguide, and electrically coupled to the frontside electrical RDL, the optical transmitter arranged to provide an optically modulated output data signal to the optical waveguide;
- or
- an optical receiver at least partially embedded within the molding compound layer, optically coupled to the optical waveguide, and electrically coupled to the frontside electrical RDL, the optical receiver arranged to receive an optically modulated input data signal from the optical waveguide;
- and
- a backside electrical RDL electrically coupled on one end to the frontside electrical RDL by vias and on another end to a circuit substrate via solder, wherein at least one of the optical transmitter and the optical receiver is arranged between the frontside electrical RDL and the backside electrical RDL and wherein the backside electrical RDL is separated from the at least one of the optical transmitter and the optical receiver by the molding compound layer.
A method comprising:
- applying a molding compound to a plurality of opto-electronic dies, each opto-electronic die arranged with a respective optically active surface facing a carrier;
- applying a respective backside electrical redistribution layer (RDL) to each opto-electronic die, wherein the applying the respective backside electrical RDL comprises coupling a respective backside electrical RDL of at least one of the opto-electronic dies with at least a circuit substrate and a respective frontside electrical RDL and wherein the respective backside electrical RDL is separated, by the molding compound, from at least one of an optical transmitter and an optical receiver arranged between the respective frontside electrical RDL and the respective backside electrical RDL;
- exposing, by removing the carrier, the respective optically active surfaces;
- applying a respective frontside electrical redistribution layer (RDL) to each opto-electronic die;
- and
- separating, by cutting the molding compound, the plurality of opto-electronic dies into individual opto-electronic dies.
Dependencies are inferred from the claim text.