Scintillator array, method for manufacturing scintillator array, radiation detector, and radiation inspection device
AssigneesKabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
InventorsHiroyasu Kondo, Kazumitsu Morimoto
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Abstract
A scintillator array includes: a structure having at least one scintillator segment and a first reflective layer, the at least one scintillator segment and the first reflective layer having a first surface and a second surface, the at least one scintillator segment having a sintered compact containing a rare earth oxysulfide phosphor, and the first reflective layer being configured to reflect light; and a second reflective layer provided above the first surface via an adhesive layer, the adhesive layer having a thickness of 2 μm or more and 40 μm or less, and the second reflective layer having a film configured to reflect light.
Claims12
A scintillator array comprising:
- a scintillator segment having a sintered compact;
- a first reflective layer configured to reflect light;
- an adhesive layer containing resin, being provided on the-scintillator segment and the first reflective layer, and having a thickness of 2 μm or more and 40 μm or less;
- and
- a second reflective layer containing resin, provided on the adhesive layer and configured to reflect light, wherein
- the second reflective layer has a sheet-shaped resin film bonded to the scintillator segment via the adhesive layer,
- the adhesive layer is configured to bond the sheet-shaped resin film to the scintillator segment and the first reflective laver, and
- the scintillator array has a warpage of 50 μm or less.
A method for manufacturing a scintillator array, comprising:
- forming a scintillator segment having a sintered compact;
- forming a first reflective layer between a plurality of the scintillator segments separated from each other, the first reflective layer being configured to reflect light;
- forming an adhesive layer on the scintillator segment and the first reflective layer, the adhesive layer containing resin and having a thickness of 2 μm or more and 40 μm or less;
- and
- forming a second reflective layer on the adhesive layer, the second reflective layer containing resin and being configured to reflect light, wherein
- the second reflective layer has a sheet-shaped resin film bonded to the scintillator segment via the adhesive layer,
- the adhesive layer is configured to bond the sheet-shaped resin film to the scintillator segment and the first reflective laver, and
- the scintillator array has a warpage of 50 μm or less.
Dependencies are inferred from the claim text.