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US 12,503,290 B2Granted
Blister packages containing active material and methods of making and using same
AssigneeCSP Technologies, Inc.
InventorJames Hollinger
Life of this patent
Estimating the term…
Abstract
A blister pack including a backing and an active layer coextensively attached to the backing. A cover is attached to the layer. The cover forms one or more spaced-apart blisters. Each blister and the layer combine to form a cavity configured to enclose at least one product. The active layer within each blister is embossed to form one or more points of weakness configured to facilitate rupture of the backing and active layer when dispensing a product from the blister.
Claims20
A composite comprising:
- a backing having a first surface and an opposing second surface;
- and
- an active layer having a first surface and an opposing second surface, the second surface of the active layer being attached coextensively to the first surface of the backing, wherein the first surface of the active layer is embossed to form one or more points of weakness.
A method of making a composite, the method comprising:
- attaching a layer including an active agent to a foil backing;
- and
- embossing a surface of the layer opposite the foil backing to form one or more points of weakness therein.
Dependencies are inferred from the claim text.