Method for connecting a film to a substrate

A method for connecting a film (102) to a substrate (101), comprising the following steps:

• providing (402) a film (102) and a substrate (101),
• bringing (403) the film (102) and the substrate (101) together,
• applying (404) a clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101),
• heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together, wherein the clamping force is maintained during the heating,
• wherein in the step of heating, the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201),
• wherein, at least in the step of heating, the clamping force is applied by a weight force of at least one mass element (104) in contact with the film (102),
• wherein, at least in the step of heating, the at least one mass element (104) is slidably mounted perpendicular to a surface of the film (102),
• wherein, at least in the step of heating, the at least one mass element (104) is slidably mounted along a direction parallel to a surface of the film (102), wherein the direction corresponds to a mean thermal expansion direction in the at least one clamping region (201).