Server heat dissipation system based on gravity heat pipe

A server heat dissipation system based on a gravity heat pipe for dissipating heat from a chip of a server, comprising:

• an evaporator arranged in a chassis of the server and being in thermal contact with the chip, said evaporator having a first cavity internally;
• a condenser arranged above the server, said condenser having a second cavity internally;
• and
• a heat-insulated pipe section passing through the chassis and connecting the evaporator and the condenser, and communicating with the first cavity and the second cavity, wherein the evaporator, the condenser and the insulated pipe section are made to form the gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state by retracting and releasing heat;
• wherein the heat generated by the chip is transferred to the working substance in liquid state in the first cavity through the evaporator, the working substance absorbs heat and is converted into gaseous state, rising to the second cavity of the condenser through the heat-insulated pipe section, the heat of the working substance is transferred to an external environment through the condenser, and the working substance is converted into liquid state and descends to the first cavity through the heat-insulated pipe section,
• the server heat dissipation system further comprising:
• a condenser heat exchanger mounted on the condenser for driving a medium in the external environment of the condenser to flow to take away the heat transferred from the condenser to the external environment, and
• a refrigeration device for decreasing a temperature of the medium in the external environment of the condenser and the condenser heat exchanger, such the heat from the chip is transferred to the medium in the external environment of the condenser and the condenser heat exchanger.

A server heat dissipation system based on a gravity heat pipe for dissipating heat from a chip of a server, comprising:

• an evaporator arranged in a chassis of the server and being in thermal contact with the chip, said evaporator having a first cavity internally;
• a condenser arranged above the server, said condenser having a second cavity internally;
• and
• a heat-insulated pipe section passing through the chassis and connecting the evaporator and the condenser, and communicating with the first cavity and the second cavity, wherein the evaporator, the condenser and the insulated pipe section are made to form the gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state by retracting and releasing heat;
• wherein the heat generated by the chip is transferred to the working substance in liquid state in the first cavity through the evaporator, the working substance absorbs heat and is converted into gaseous state, rising to the second cavity of the condenser through the heat-insulated pipe section, the heat of the working substance is transferred to an external environment through the condenser, and the working substance is converted into liquid state and descends to the first cavity through the heat-insulated pipe section,
• wherein the outer surface of the heat-insulated pipe section is covered with heat-insulated and flame-retardant material.