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US 12,501,538 B2Granted
Thermal solutions for cooling electronic devices
AssigneeIntel Corporation
InventorsJeff Ku, Baomin Liu, Cora Nien, Min Suet Lim, Tongyan Zhai
Life of this patent
Estimating the term…
Abstract
Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.
Claims16
An electronic device comprising:
- a printed circuit board;
- a first cooling plate at a first side of the printed circuit board;
- a second cooling plate at a second side of the printed circuit board, the second side opposite the first side, and the second cooling plate fluidically coupled with the first cooling plate;
- a coolant to flow between the first cooling plate and the second cooling plate;
- and
- a polyester film having an electrode to conduct an electromagnetic field to create flow of the coolant, wherein the polyester film includes a first layer on the first cooling plate and a second layer on the second cooling plate.
3 more elements
An electronic device comprising:
- a heat generating component;
- a first cooling plate at a first side of the heat generating component;
- a second cooling plate at a second side of the heat generating component;
- means for fluidly coupling the first cooling plate and the second cooling plate;
- a coolant to flow in the means for fluidly coupling;
- and
- a polyester film having means for creating a flow of the coolant between the first cooling plate and the second cooling plate, the polyester film includes a first layer on the first cooling plate and a second layer on the second cooling plate.
4 more elements
Dependencies are inferred from the claim text.