Headset, headset assembly, and related method

A headset comprising:

• a headband;
• and
• two earmuffs, wherein the two earmuffs are respectively connected to two ends of the headband;
• and
• wherein each of the earmuffs comprises:
• an ear housing, connected to the headband;
• an earpad, fastened to the ear housing, wherein the earpad is made of a flexible material or an elastic material;
• a first SMA component, embedded in the earpad, wherein when the first SMA component reaches phase transition temperature, the earpad is driven to deform to an expanded form;
• and
• a second SMA component, embedded in the earpad, wherein the second SMA component and the first SMA component are independent of each other, and when the second SMA component reaches phase transition temperature, the earpad is driven to deform to a shrunk form.

A method of manufacturing an earbud, comprising:

• performing injection molding and curing to form a base;
• performing injection molding to form a first soft colloid, wherein the first soft colloid is connected to the base;
• curing the first soft colloid to form a first part of an earbud body, wherein the first part of the earbud body has a mounting slot;
• mounting the SMA component in the mounting slot;
• performing injection molding to form a second soft colloid, wherein the second soft colloid is connected to the first soft colloid, and the second soft colloid covers the mounting slot;
• and
• curing the second soft colloid to form a second part of the earbud body, and assembling the second part of the earbud body and the first part of the earbud body to form the earbud body, wherein the earbud body is wrapped around the SMA component.