Acoustic wave device with multi-layer substrate including ceramic
AssigneeSkyworks Solutions, Inc.
InventorsHironori Fukuhara, Rei Goto, Keiichi Maki
Life of this patent
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Abstract
An acoustic wave device is disclosed. The acoustic wave device includes a support layer, a ceramic layer positioned over the support layer, a piezoelectric layer positioned over the ceramic layer, and an interdigital transducer electrode positioned over the piezoelectric layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The acoustic wave device can be a surface acoustic wave device configured to generate a surface acoustic wave.
Claims20
An acoustic wave filter comprising:
- a first acoustic wave resonator including a support substrate, a ceramic layer over the support substrate, the ceramic layer having a thickness that is at least equal to or greater than a wavelength λ of the first acoustic wave resonator, the ceramic layer configured to scatter back reflections to reduce spurious modes associated with back reflections, and the support substrate having a higher thermal conductivity than the ceramic layer, a piezoelectric layer over the ceramic layer, and at least a first interdigital transducer electrode over the piezoelectric layer;
- and
- electrically connecting the first acoustic wave resonator to at least a second acoustic wave resonator.
A method of manufacturing an acoustic wave filter that filters a radio frequency signal, the method comprising:
- forming a first acoustic wave resonator by attaching a support substrate to a ceramic layer, the ceramic layer having a thickness that is at least equal to or greater than a wavelength λ of the first acoustic wave resonator, the ceramic layer configured to scatter back reflections to reduce spurious modes associated with back reflections, and the support substrate having a higher thermal conductivity than the ceramic layer, bonding a piezoelectric layer to a surface of the ceramic layer, and forming at least a first interdigital transducer electrode over the piezoelectric layer;
- and
- electrically connecting the first acoustic wave resonator to at least a second acoustic wave resonator.
Dependencies are inferred from the claim text.