Thermal conduction based batch testing system
AssigneeMicron Technology, Inc.
InventorDaniel P. Cram
Life of this patent
Estimating the term…
Abstract
Methods, systems, and devices for thermal conduction based batch testing system are described. A testing system may include a set of memory devices may arranged on a loading cartridge and placed within the testing system. The testing system may include one or more test boards located in parallel with the memory devices within the testing system. In some cases, the testing system may push the test boards toward the cartridge, causing the memory devices to thermally couple with a heater board. The testing system may include a fluid filled cooling plate thermally coupled with the heater board. In some examples, the testing system may generate a vacuum within a housing containing the test boards and cartridge, which may cause the outside atmosphere to apply a force on the test boards towards the heater board.
Claims18
An apparatus, comprising:
- a housing comprising:
- a first thermal plate coupled with a thermal regulation system;
- a second thermal plate;
- a test board;
- and
- a pliable membrane between a first portion of the housing and a second portion of the housing, the pliable membrane configured to allow the second portion of the housing to move along a dimension orthogonal to the second thermal plate, wherein the housing is configured to:
- receive a cartridge selectively coupled with a plurality of memory devices in a region between the second thermal plate and the test board;
- and
- apply a force on the test board toward the second thermal plate, wherein the test board is configured to electrically couple with the cartridge in response to the force, wherein the movement of the second portion of the housing applies the force on the plurality of memory devices against the second thermal plate and the test board against the cartridge.
An apparatus, comprising:
- a housing comprising:
- a first thermal plate coupled with a thermal regulation system;
- a second thermal plate;
- a test board;
- and
- a pliable membrane between a first portion of the housing and a second portion of the housing, the pliable membrane configured to allow the second portion of the housing to move along a dimension orthogonal to the second thermal plate, wherein the housing is configured to:
- receive a cartridge selectively coupled with a plurality of memory devices within a region disposed between the second thermal plate and the test board;
- and
- move the test board to be electrically coupled with the cartridge and the plurality of memory devices to be thermally coupled with the second thermal plate, wherein the movement of the second portion of the housing applies a force on the plurality of memory devices against the second thermal plate and the test board against the cartridge.
A method, comprising:
- inserting a cartridge comprising a plurality of memory devices into a region of a housing, the housing comprising a first thermal plate coupled with a thermal regulation system, a second thermal plate, and a pliable membrane between a first portion of the housing and a second portion of the housing, the pliable membrane configured to allow the second portion of the housing to move along a dimension orthogonal to the second thermal plate;
- reducing a pressure within the housing to move a test board to electrically couple with the cartridge and to apply a force to the cartridge to move the plurality of memory devices to thermally couple with the second thermal plate, wherein the movement of the second portion of the housing applies the force on the plurality of memory devices against the second thermal plate and the test board against the cartridge;
- and
- performing one or more functional tests of the plurality of memory devices using the test board based at least in part on reducing the pressure.
Dependencies are inferred from the claim text.