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US 12,499,343 B2Granted
Wafer-level package sensor device
AssigneeInfineon Technologies AG
InventorsFrank Püschner, Mark Pavier, Bernd Ebersberger
Life of this patent
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Abstract
A wafer-level package sensor device including a capacitive sensor, a controller which is electrically conductively connected to the sensor, wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes, and multiple contact surfaces connected to the controller, which are configured to electrically couple to a chip card module carrier using a flip-chip connection.
Claims18
A wafer-level package sensor device, comprising:
- a capacitive sensor;
- a controller which is electrically conductively connected to the sensor,
- wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes;
- and
- multiple contact surfaces which are connected to the controller and configured to electrically couple to a chip-card module carrier using a flip-chip connection,
- wherein the multiple contact surfaces and a sensor surface of the capacitive sensor are exposed on a same side of the wafer-level package sensor device.
3 more elements
A method for forming a wafer-level package sensor device, the method comprising:
- forming a capacitive sensor by forming partially overlapping redistribution layer tracks of the wafer-level package sensor device in different planes;
- connecting a controller to the sensor in an electrically conductive manner;
- and
- forming multiple contact surfaces which are connected to the controller and configured to electrically couple to a chip card module carrier using a flip-chip connection,
- wherein the multiple contact surfaces and a sensor surface of the capacitive sensor are exposed on the same side of the wafer-level package sensor device.
2 more elements
Dependencies are inferred from the claim text.