Monomer, resin for photoresist, resin composition for photoresist, and pattern forming method

Abstract

Provided is a monomer that improves solubility in organic solvents, hydrolyzability, and solubility in water after hydrolysis of a resin as well as imparts higher heat resistance to a resin. A resin for a photoresist containing a polymerization unit represented by Formula (Y), wherein Rh represents a halogen atom or an alkyl group having from 1 to 6 carbons and having a halogen atom; R1 is a substituent attached to a ring and represents a halogen atom, an alkyl group that has from 1 to 6 carbons and may have a halogen atom, a hydroxyalkyl group that has from 1 to 6 carbons and may have a halogen atom and has a hydroxyl group moiety which may be protected by a protecting group, a carboxyl group that may form a salt, or a substituted oxycarbonyl group; A represents an alkylene group having from 1 to 6 carbons, an oxygen atom, a sulfur atom, or no bond; m is the number of R1 and represents an integer from 0 to 8; X represents an electron-withdrawing substituent; n is the number of X and represents an integer from 1 to 9; B represents a single bond or a linking group; and a steric position of a COOB-group attached to a polymer chain may be either endo or exo.

Dependencies are inferred from the claim text.