Image pickup apparatus, endoscope, and method of manufacturing image pickup apparatus

An endoscope comprising an image pickup apparatus, the image pickup apparatus comprising:

• a lens unit including a plurality of optical devices, the plurality of optical devices having a common optical axis and including a first optical device, the first optical device including:
• a first glass substrate having a first principal surface and a second principal surface on a side opposite to the first principal surface, the first glass substrate having four side surfaces connecting the first principal surface and the second principal surface, and a groove leading to the second principal surface from the first principal surface in at least one of four corners on an outer edge, the at least one of the four corners of the first glass substrate being at an intersection of adjacent side surfaces of the four side surfaces of the first glass substrate;
• first resin disposed in the groove of the first glass substrate;
• and
• a resin lens disposed on the second principal surface;
• and
• an image pickup unit including an image pickup device, the image pickup unit being disposed on an optical device not including the first resin, of the plurality of optical devices.

A method of manufacturing an image pickup apparatus, the method comprising:

• forming a plurality of holes disposed in a grid pattern on a glass wafer;
• filling each of the plurality of holes with first resin;
• disposing a plurality of resin lenses on the glass wafer to produce a first lens wafer including an incident surface;
• stacking a plurality of optical device wafers including the first lens wafer to produce a stacked wafer where the plurality of optical device wafers have a common optical axis;
• disposing an image pickup unit including an image pickup device on an optical device wafer including an emission surface and not including the first resin, of the plurality of optical device wafers;
• and
• dicing the stacked wafer along cut lines forming side surfaces of the glass wafer, the cut lines including the plurality of holes filled with the first resin at an intersection of adjacent side surfaces of the side surfaces of the glass wafer.