Probe card and thermal conduction device thereof
AssigneeStar Technologies Inc.
InventorsChoon Leong Lou, Ho-Yeh Chen
Life of this patent
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Abstract
The present disclosure provides a probe card and a thermal conduction device thereof. The thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. The probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face toward an opening of the corresponding accommodation space. Second ends of the probes face toward another opening of the corresponding accommodation space.
Claims14
A probe card, comprising:
- a thermal conduction device comprising:
- a plurality of first walls;
- and
- a plurality of second walls, wherein the first walls and the second walls cross to each other to define a plurality of receiving spaces;
- at least one heat-dissipating component in contact with at least a portion of the first walls and the second walls;
- and
- a plurality of probe assemblies disposed in the receiving spaces and each comprising:
- a plurality of probes;
- and
- a case for receiving the probes,
- wherein the cases are in contact with the thermal conduction device,
- wherein first ends of the probes face openings of the receiving spaces, and second ends of the probes face other openings of the receiving spaces.
A thermal conduction device, comprising:
- a plurality of first walls;
- a plurality of second walls;
- a plurality of receiving spaces formed by cross between the first walls and the second walls, the plurality of receiving spaces receiving a plurality of probe assemblies, wherein a plurality of cases of the probe assemblies are in contact with the thermal conduction device;
- and,
- at least one heat-dissipating component in contact with at least a portion of the first walls and the second walls,
- wherein each of the receiving spaces has a first opening and a second opening, the first openings expose first ends of a plurality of probes of the probe assemblies, and the second openings expose second ends of the probes of the probe assemblies,
- wherein a plurality of heat conduction paths are provided between the thermal conduction device and the cases of the probe assemblies when the receiving spaces receive the probe assemblies.
Dependencies are inferred from the claim text.