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US 12,497,707 B2Granted
Ag-plated material, method for producing Ag-plated material, and electrical component
AssigneeDowa Metaltech Co., Ltd.
InventorsYosuke Sato, Yutaro Hirai, Kentaro Arai
Life of this patent
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Abstract
There is provided an Ag-plated material and a related technique, including: an Ag-plated layer on a substrate that comprises a conductive metal; and a plurality of two-layer plating structures on the substrate, the two-layer plating structures having a porous Ni-plated layer and an Ag-plated layer in this order from a substrate side.
Claims12
An Ag-plated material, comprising:
- a plurality of two-layer plating structures formed on a substrate that comprises a conductive metal, each two-layer plating structure of the plurality of the two-layer plating structures having a porous Ni-plated layer and an Ag-plated layer in this order from the substrate side;
- and
- an underlying Ni-plated layer between the two-layer plating structure closest to the substrate, and the substrate.
A method for producing an Ag-plated material, the method comprising:
- forming a plurality of two-layer plating structures on a substrate that comprises a conductive metal, wherein each two-layer plating structure of the plurality of the two-layer plating structures is formed such that it has a porous Ni-plated layer and an Ag-plated layer in this order from the substrate side on the substrate;
- wherein
- an underlying Ni-plated layer is formed between the two-layer plating structure closest to the substrate, and the substrate.
Dependencies are inferred from the claim text.