Back to results
US 12,497,543 B2Granted
Structural adhesives
AssigneeZephyros, Inc.
InventorMichael Czaplicki
Life of this patent
Estimating the term…
Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
Claims20
A process for forming an adhesive formulation comprising blending:
- i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;
- ii) a solution of a phenoxy epoxy hybrid resin formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, wherein the adhesive formulation contains between 3% and 10% by weight of phenoxy resin;
- iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;
- and
- iv) one or more additional epoxy resins;
- wherein the adhesive formulation includes between about 55% by weight and about 75% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins, and
- wherein the adhesive formulation is a liquid or paste at room temperature.
4 more elements
Dependencies are inferred from the claim text.