Highly adhesive and low-dialectric polyimide film and method for producing same

A method for manufacturing a polyimide film, the method including the steps of:

• preparing a polyamic acid solution;
• preparing a polyamic acid composition by adding a dehydrating agent and an imidizing catalyst to the polyamic acid solution;
• and
• applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater,
• wherein the thermosetting step comprises a first heating step, a second heating step, and a third heating step, each of the first, the second, and the third step being carried out in a processing temperature range of 100° C. to 550° C.,
• wherein the polyamic acid solution contains an acid dianhydride component including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA) and a diamine component including m-tolidine, 4,4′-oxydianiline (ODA), and para-phenylenediamine (p-phenylenediamine PPD),
• wherein the 3,3′,4,4′-biphenyltetracarboxylic dianhydride is used at a content of 30 mole % to 50 mole % and the pyromellitic dianhydride is used at a content of 50 mole % to 70 mole %, based on a total of 100 mole % of the acid dianhydride component;
• and
• wherein the m-tolidine is used at a content of 60 mole % to 80 mole %, p-phenylenediamine used at a content of from 10 mole % to 25 mole %, and 4,4′-oxydianiline (ODA) used at a content of from 10 mole % to 25 mole %, based on a total of 100 mole % of the diamine component.