Low-dialectric polyimide film and method for producing same

A method for manufacturing a polyimide film, the method comprising the steps of:

• preparing a polyamic acid solution;
• preparing a polyamic acid composition by adding 2-3 mole equivalents of a dehydrating agent to the polyamic acid solution;
• and
• applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater, wherein the polyamic acid solution contains:
• an acid dianhydride component including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA);
• and
• a diamine component including m-tolidine, 4,4′-oxydianiline (ODA), and p-phenylenediamine (PPD), wherein 3,3′,4,4′-biphenyltetracarboxylic dianhydride is used at a content of 30% by mole to 50% by mole and pyromellitic dianhydride is used at a content of 50% by mole to 70% by mole, based on a total of 100% by mole of the acid dianhydride component;
• and
• wherein m-tolidine is used at a content of 60% by mole to 80% by mole for, p-phenylenediamine is used at a content of from 10% by mole to 25% by mole, and 4,4′-oxydianiline (ODA) is used at a content of from 10% by mole to 25% by mole, based on a total of 100% by mole of the diamine component.