Apparatus, system and method for providing an end effector

An end effector capable of accommodating semiconductor wafers of varying sizes, comprising:

• a wafer support;
• a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof;
• a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers;
• a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer for the physical interfacing of the semiconductor wafer with the plurality of support pads;
• and
• a low friction vacuum cylinder engaged with the bi-directional drive of the moving clamp,
• wherein the vacuum cylinder comprises a seal-less glass tube with a graphite piston.

An end effector capable of accommodating semiconductor wafers of varying sizes, comprising:

• a wafer support;
• a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof;
• at least four support pads on the wafer support for physically interfacing with a one of the semiconductor wafers;
• and
• a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm,
• wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer for the physical interfacing of the semiconductor wafer with the plurality of support pads,
• wherein at least two of the support pads are proximal to the bearing arm, and
• wherein at least two others of the support pads are distal to the bearing arm.