Methods of processing semiconductor wafers using double side grinding operations

A method of processing a semiconductor wafer using a double side grinding apparatus that includes a first grinding wheel, a second grinding wheel, and a carrier for supporting the wafer between the first and second grinding wheels, the wafer having a front surface and a back surface, the method comprising:

• placing the wafer in the carrier such that the first grinding wheel engages the front surface of the wafer and the second grinding wheel engages the back surface of the wafer;
• performing a first grinding operation of the double side grinding apparatus on the wafer in which the first and second grinding wheels rotate in counter-rotation manner relative to each other and the wafer is rotated in a wafer rotation direction that matches a rotational direction of one of the first grinding wheel and the second grinding wheel, whereby a first portion of at least one of the front and back surfaces of the wafer is removed;
• performing a second grinding operation of the double side grinding apparatus on the wafer in which at least one process parameter is adjusted relative to the first grinding operation, whereby a second portion of at least one of the front and back surfaces of the wafer is removed to enhance at least one of in plane displacement, warp, and nanotopology of the wafer;
• and
• performing a third grinding operation of the double side grinding apparatus on the wafer, whereby a third portion of at least one of the front and back surfaces of the wafer is removed.

A method of processing semiconductor wafers using a double side grinding apparatus that includes first grinding wheels, second grinding wheels each corresponding to one of the first grinding wheels, and carriers for respectively supporting each of the wafers between one of the first grinding wheels and the corresponding second grinding wheel during a grinding operation, each wafer having a front surface and a back surface, the method comprising, for each wafer:

• placing the wafer in the respective carrier such that the first grinding wheel engages the front surface of the respective wafer and the corresponding second grinding wheel engages the back surface of the respective wafer;
• performing a first grinding operation of the double side grinding apparatus on the wafer in which the first and corresponding second grinding wheels rotate in counter-rotation manner relative to each other and the respective wafer is rotated in a wafer rotation direction that matches a rotational direction of the first grinding wheel, whereby a first portion of at least one of the front and back surfaces of the respective wafer is removed;
• performing a second grinding operation of the double side grinding apparatus on the wafer in which the first and corresponding second grinding wheels rotate in counter-rotation manner relative to each other and the respective wafer is rotated in a second direction that matches a rotational direction of the second grinding wheel, whereby a second portion of at least one of the front and back surfaces of the respective wafer is removed;
• and
• performing a third grinding operation of the double side grinding apparatus on the wafer, whereby a third portion of at least one of the front and back surfaces of the respective wafer is removed.