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US 12,495,636 B2Granted
Optocoupler
AssigneeBridgelux Optoelectronics (Xiamen) Co., Ltd.
InventorsGuo-Heng Qin, Yi-Qun Li, Yeh-Yin Chou
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Abstract
An optocoupler includes a light output chip and a light-sensing chip. A light-receiving surface of the light-sensing chip is disposed to face a light output surface of the light output chip. The light-sensing chip and the light output chip are a green light-emitting diode and a blue light-emitting diode, respectively. Accordingly, the optocoupler has a stable output performance at a working temperature ranging from −55° C. to 150° C. and a high response frequency.
Claims13
An optocoupler, comprising:
- an electrical substrate, including an insulating layer, a first pad assembly, a second pad assembly, a first electrode assembly, and a second electrode assembly;
- wherein the first pad assembly and the second pad assembly are disposed on a first side of the insulating layer and are spaced apart from each other, the first electrode assembly and the second electrode assembly are disposed on an opposite second side of the insulating layer, the first electrode assembly is electrically connected to the first pad assembly through first conductive pillars, the second electrode assembly is electrically connected to the second pad assembly through second conductive pillars, the first pad assembly comprises two first pads spaced apart from each other, and the second pad assembly comprises two second pads spaced apart from each other;
- a blue-emitting diode, acting as a light output chip, wherein the blue-emitting diode has a horizontal structure and is disposed on the two first pads of the electrical substrate in a flipped manner to form an electrical connection with the two first pads, wherein the two first pads are located between the insulting layer and the blue-emitting diode;
- a green-emitting diode, acting as a light-sensing chip, wherein a light-receiving surface of the green-emitting diode is disposed to face a light output surface of the blue-emitting diode, and the green-emitting diode has a horizontal structure and is stacked on the blue-emitting diode;
- and
- two conductive wires, wherein two electrodes of the light-sensing chip are electrically connected to the two second pads through the two conductive wires.
3 more elements
An optocoupler, comprising:
- an electrical substrate, including an insulating layer, a first pad assembly, a second pad assembly, a first electrode assembly, and a second electrode assembly;
- wherein the first pad assembly and the second pad assembly are disposed on a first side of the insulating layer and are spaced apart from each other, the first electrode assembly and the second electrode assembly are disposed on an opposite second side of the insulating layer, the first electrode assembly is electrically connected to the first pad assembly, the second electrode assembly is electrically connected to the second pad assembly, the first pad assembly comprises two first pads spaced apart from each other, and the second pad assembly comprises two second pads spaced apart from each other;
- a light output chip, having a horizontal structure and disposed on the two first pads of the electrical substrate in a flipped manner to form an electrical connection with the two first pads, wherein the two first pads are located between the insulting layer and the light output chip;
- and
- a light-sensing chip, having a horizontal structure and stacked on the light output chip, wherein a light-receiving surface of the light-sensing chip is disposed to face towards a light output surface of the light output chip, the light output chip is one of a blue light-emitting diode and a green light-emitting diode, and the light-sensing chip is the other one of the blue light-emitting diode and the green light-emitting diode;
- conductive wires, wherein two electrodes of the light-sensing chip are electrically connected to the two second pads through the conductive wires;
- a light permeable layer, sandwiched between the light output surface of the light output chip and the light-receiving surface of the light-sensing chip, wherein a material of the light permeable layer is a resin;
- and
- a cover structure, disposed to cover the light output chip, the light-sensing chip, the light permeable layer, and the conductive wires.
6 more elements
Dependencies are inferred from the claim text.