Device for thermal regulation of at least one electronic component

A device for thermally regulating at least one electronic component, said device comprising:

• at least two circulation ducts for a heat transfer fluid which are arranged along a stacking axis;
• and
• at least two heat transfer fluid manifolds in fluidic communication with the at least two circulation ducts and attached at opposite ends of the at least two circulation ducts to provide “I”-shaped fluid circulation between the at least two heat transfer fluid manifolds,
• wherein each of said at least two heat transfer fluid manifolds has;
• at least two fluidic connection portions respectively assembled at one end of a corresponding circulation duct and respectively having at least one collar bordering an orifice, and
• at least one hollow connector interposed between the at least two fluidic connection portions along the stacking axis, and having two opposite end sections mounted so as to be able to slide inside the collars of the at least two facing fluidic connection portions.