Method for adjusting flux distribution positions on circuit board

Abstract

A method for adjusting flux distribution positions on a circuit board is provided. The method includes: preparing a circuit board with a plurality of soldering joints distributed on its surface and applying a layer of flux to cover the soldering joints; performing optical alignment by transferring the circuit board to a working area, capturing an image of the circuit board with an optical camera, and calculating position information; performing laser cleaning by utilizing a laser generator to emit laser light and remove excess flux around the soldering joints based on the position information, leaving flux only on the top surfaces of the soldering joints; and conducting automated optical inspection to verify whether the circuit board is defective. This method ensures precise flux distribution on the solder joints' top surfaces, enhancing the quality and reliability of subsequent soldering processes.

Dependencies are inferred from the claim text.