Power module with press-fit contacts
AssigneeInfineon Technologies AG
InventorsIvan Nikitin, Peter Luniewski
Life of this patent
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Abstract
A method of forming a semiconductor device includes providing a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, mounting one or more semiconductor dies on a portion of the structured metallization layer, forming an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates the one or more semiconductor dies, securing a press-fit connector to the power electronics carrier with a base portion of the press-fit connector being disposed within an opening in the encapsulant body and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body.
Claims15
A method of forming a semiconductor device, the method comprising:
- providing a carrier;
- mounting a semiconductor die and a second semiconductor die on the carrier;
- mounting a metal connection frame over the semiconductor die and the second semiconductor die;
- securing a press-fit connector to the metal connection frame with a base portion of the press-fit connector being in contact with the metal connection frame;
- and
- forming an encapsulant body of electrically insulating material that covers the carrier, the semiconductor die, the second semiconductor die and the metal connection frame,
- wherein an interfacing end of the press-fit connector is electrically accessible from outside the encapsulant body,
- wherein the semiconductor device is configured as a power module that comprises a half- bridge circuit, and
- wherein the semiconductor die and the second semiconductor die form a high-side switch and a low-side switch of the half-bridge circuit, respectively.
A semiconductor device, comprising:
- a carrier
- a semiconductor die and a second semiconductor die mounted on the carrier
- a metal connection frame mounted over the semiconductor die and the second semiconductor die;
- an encapsulant body of electrically insulating material that covers the carrier, the semiconductor die, the second semiconductor die and the metal connection frame;
- and
- a press-fit connector secured to the metal connection frame with a base portion of the press-fit connector being in contact with the metal connection frame and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body,
- wherein the semiconductor device is configured as a power module that comprises a half-bridge circuit, and
- wherein the semiconductor die and the second semiconductor die form a high-side switch and a low-side switch of the half-bridge circuit, respectively.
Dependencies are inferred from the claim text.