Methods and apparatus for measuring temperature using centerfind systems
AssigneeApplied Materials, Inc.
InventorPaul Zachary Wirth
Life of this patent
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Abstract
Disclosed are systems and methods for measuring the temperature change of one or more substrates within a semiconductor processing system. The temperature change information may be used to optimize throughput of substrates within the system and to troubleshoot quality issues that may be impacted by temperature.
Claims20
An electronic device manufacturing system, comprising:
- a robot apparatus configured to transport a substrate;
- a first sensor system configured to detect the substrate supported by the robot apparatus;
- and
- a controller to:
- acquire a first set of positional metrics of the substrate generated by the first sensor system;
- determine a first radius of the substrate based on the first set of positional metrics;
- acquire a second set of positional metrics of the substrate generated by the first sensor system or a second sensor system;
- determine a second radius of the substrate based on the second set of positional metrics;
- determine a change in radius for the substrate based on the first radius and the second radius;
- and
- determine a temperature change of the substrate based on the change in radius and a coefficient of thermal expansion of the substrate.
A method of determining a temperature change of a substrate, the method comprising:
- acquiring a first set of positional metrics of the substrate generated by a first sensor system;
- determining a first radius of the substrate based on the first set of positional metrics;
- acquiring a second set of positional metrics of the substrate generated by the first sensor system or a second sensor system;
- determining a second radius of the substrate based on the second set of positional metrics;
- determining a change in radius for the substrate based on the first radius and the second radius;
- and
- determining a temperature change of the substrate based on the change in radius and a coefficient of thermal expansion of the substrate.
A non-transitory computer-readable medium having stored thereon a plurality of instructions, the plurality of instructions comprising instructions which, when executed by a processor, determine a change in temperature of a substrate in a semiconductor processing system comprising:
- acquiring a first set of positional metrics of the substrate generated by a first sensor system;
- determining a first radius of the substrate based on the first set of positional metrics;
- acquiring a second set of positional metrics of the substrate generated by the first sensor system or a second sensor system;
- determining a second radius of the substrate based on the second set of positional metrics;
- determining a change in radius for the substrate based on the first radius and the second radius;
- and
- determining a temperature change of the substrate based on the change in radius and a coefficient of thermal expansion of the substrate.
Dependencies are inferred from the claim text.