Multi-surface airtight packaging ceramic shell, multi-surface packaging device and preparation method

A method of preparing a multi-surface airtight packaging ceramic shell, wherein the method comprises:

• making a multi-surface raw porcelain body with a polyhedron shape, forming metallized through-holes on the multi-surface raw porcelain body, and printing a preset metallized pattern on each surface of the multi-surface raw porcelain body to form a solder pad on at least one surface of the multi-surface raw porcelain body;
• making raw porcelain strips, forming metallized through-holes on the raw porcelain strips, and printing a preset bonding finger pattern on each raw porcelain strip;
• and
• performing the following:
• co-firing the raw porcelain strips and remaining surfaces of the multi-surface raw porcelain body other than the at least one surface having the solder pad, into one body, and plating nickel on the one body to form a nickel-plated part;
• and
• welding sealing rings on the remaining surfaces of the co-fired one body other than the at least one surface having the solder pad, to obtain the multi-surface airtight packaging ceramic shell and form a packaging cavity configured for packaging a chip inside each sealing ring, with one or more of the co-fired porcelain strips configured for bonding the chip being inside each sealing ring and being arranged on each of the remaining surfaces of the co-fired one body, and each preset bonding finger pattern configured for bonding the chip being connected to the solder pad through one or more of the metallized through-holes on the co-fired multi-surface porcelain body.

A method of preparing a multi-surface airtight packaging ceramic shell, wherein the method comprises:

• making a multi-surface raw porcelain body with a polyhedron shape, forming metallized through-holes on the multi-surface raw porcelain body, and printing a preset metallized pattern on each surface of the multi-surface raw porcelain body to form a solder pad on at least one surface of the multi-surface raw porcelain body;
• making raw porcelain strips, forming metallized through-holes on the raw porcelain strips, and printing a preset bonding finger pattern on each raw porcelain strip;
• and
• performing the following:
• co-firing the raw porcelain strips and remaining surfaces of the multi-surface raw porcelain body other than the at least one surface having the solder pad, into one body, and plating nickel on the one body to form a nickel-plated part;
• and
• welding sealing rings on the remaining surfaces of the co-fired one body other than the at least one surface having the solder pad, to obtain the multi-surface airtight packaging ceramic shell and form a packaging cavity configured for packaging a chip inside each sealing ring, with one or more of the co-fired porcelain strips configured for bonding the chip being inside each sealing ring and being arranged on each of the remaining surfaces of the co-fired one body, and each preset bonding finger pattern configured for bonding the chip being connected to the solder pad through one or more of the metallized through-holes on the co-fired multi-surface porcelain body;
• wherein the raw porcelain strips are arranged around an inner periphery of each sealing ring to form a ceramic ring.