Plasma processing apparatus, method for manufacturing upper electrode assembly, and method for reproducing upper electrode assembly

A plasma processing apparatus comprising:

• a plasma processing chamber;
• a substrate support disposed in the plasma processing chamber;
• a lower electrode disposed in the substrate support;
• a conductive member disposed above the substrate support, the conductive member including:
• at least one coolant inlet and at least one coolant outlet;
• a gas supply port;
• and
• a plurality of gas diffusion spaces fluidly connected to the gas supply port, the plurality of gas diffusion spaces being spaced apart from one another, the conductive member being connected to an RF potential or a DC potential;
• and
• an upper electrode assembly including:
• a conductive plate detachably connected to a bottom surface of the conductive member, the conductive plate having one or more coolant channels, at least one coolant inlet and at least one coolant outlet, the one or more coolant channels communicating with the at least one coolant inlet and the at least one coolant outlet;
• an electrode plate disposed below the conductive plate;
• and
• a conductive bonding sheet disposed between the electrode plate and the conductive plate,
• wherein the conductive plate further includes a conductive coat layer formed on at least a bottom surface and side surfaces of the conductive plate to electrically connect the conductive member and the conductive bonding sheet.