Semiconductor module, method for fabricating a semiconductor module, and system

A method for fabricating a semiconductor module, the method comprising:

• providing a semiconductor die;
• encapsulating the semiconductor die with an encapsulation;
• and
• electrically coupling a first and a second power contact to the semiconductor die,
• wherein the first and second power contacts each comprise an external part exposed from the encapsulation and an overlapping part,
• wherein the first power contact is configured to carry a first current and the second power contact is configured to carry a second current,
• wherein a current flow of the first current in the external part of the first power contact points into or out of the semiconductor module and a current flow of the second current in the external part of the second power contact points in the opposite direction of the current flow of the first current in the external part of the first power contact,
• wherein the overlapping part of the first power contact and the overlapping part of the second power contact overlap one another such that a current flow of the first current in the overlapping part of the first power contact and a current flow of the second current in the overlapping part of the second power contact point in the same direction,
• wherein the overlapping part of each of the first power contact and the second power contact comprises a slot configured to accept a current sensor element, wherein the slot of the first power contact and the slot of the second power contact overlap one another, and wherein the current sensor element is configured to measure a combined current in the overlapping part of the first power contact and the overlapping part of the second power contact.