Device of inspecting defects of wafer diced or aligned

A device for inspecting defects of a wafer diced or aligned, the device being adapted to inspect a wafer, the wafer comprising, after being diced or aligned, a silicon wafer layer and a blue film affixed to a bottom of the silicon wafer layer, the device comprising:

• an immersion liquid detector having a casing, the casing having a through hole disposed at an upper portion of the casing and having a transparent lid for covering the through hole, with the transparent lid disposed below the blue film and spaced apart from the blue film by a predetermined distance, allowing a liquid to flow through and fill between the blue film and the transparent lid;
• a lens assembly disposed in the casing and disposed below the transparent lid;
• an optical lens assembly disposed in the casing and disposed below the lens assembly;
• a light source disposed in the casing and adapted to generate visible light and infrared light, wherein the visible light and the infrared light pass through the optical lens assembly, the lens assembly and the transparent lid before exiting therefrom;
• a visible-light camera disposed in the casing and adapted to perform imaging on the visible light in the casing through the optical lens assembly after the visible light has entered the casing;
• and
• an infrared camera disposed in the casing and adapted to perform imaging on the infrared light in the casing through the optical lens assembly after the infrared light has entered the casing.