Material for locating gas leak, method for locating gas leak, material for repairing gas leak, method for repairing gas leak, and device for repairing gas leak
AssigneeDexerials Corporation
InventorsYasutaka Mori, Takaaki Kubota, Tetsuya Abe
Life of this patent
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Abstract
Provided is a gas leak locating material used for locating a gas leaking position by application thereof at a position suspected to have a gas leak. The gas leak locating material satisfies the following formula: A/B≥21.0, where A represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s−1 and B represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 10 s−1. The gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured.
Claims12
A gas leak locating material used for locating a gas leaking position by application of the gas leak locating material at a position suspected to have a gas leak, wherein
- the gas leak locating material contains a curable resin composition containing a polymerizable compound and a polymerization initiator,
- the gas leak locating material satisfies a formula:
- A/B≥21.0, where A represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s−1 and B represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 10 s−1, and
- the gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured, where the elastic modulus E′ is determined by performing a temperature sweep using a rheometer in tensile mode at a frequency of 10 Hz, with a temperature elevation rate of 10° C./min, over a temperature range from 25° C. through 100° C., on a cured sample of 1 mm thickness.
Dependencies are inferred from the claim text.