Hybrid structure and a method for manufacturing the same
AssigneeSoitec
InventorDidier Landru
Life of this patent
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Abstract
A hybrid structure includes a support substrate having a first coefficient of thermal expansion and a support thickness, and an effective layer disposed on and molecularly bonded to the support substrate along a bonding interface having a bonding energy greater than or equal to 1000 mJ/m2. The effective layer has an effective thickness and a second coefficient of thermal expansion greater than the first coefficient of thermal expansion of the support substrate. One or more non-bonded areas are present at the bonding interface between the effective layer and the support substrate. The effective thickness is less than a threshold thickness at which buckling of the effective layer occurs upon annealing of the hybrid structure at a temperature of 400° C.±200° C.
Claims15
A hybrid structure, comprising:
- a support substrate having a first coefficient of thermal expansion and a support thickness;
- and
- an effective layer disposed on and molecularly bonded to the support substrate along a bonding interface having a bonding energy greater than or equal to 1000 mJ/m2, the effective layer having an effective thickness, the effective layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion of the support substrate;
- wherein one or more non-bonded areas are present at the bonding interface between the effective layer and the support substrate, and the effective thickness is less than a threshold thickness at which buckling of the effective layer occurs upon annealing of the hybrid structure at a temperature of 400° C.±200° C.
Dependencies are inferred from the claim text.