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US 12,490,377 B2Granted
Composite films for mobile electronic device components
AssigneesSyensqo Specialty Polymers USA, LLC, Cytec Industries Inc.
InventorsNan Chen, Lewis Karl Williams, Val Glade Gunther, Marco Apostolo, Devang Khariwala
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Abstract
The present disclosure relates to a composite film made of at least LCP and a fiber fabric, for example presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).
Claims21
A composite film comprising:
- at least one Liquid Crystalline Polyester (LCP), and
- at least one fiber fabric (F),
- wherein the LCP comprises:
- a) repeat units of formula (IV):
- b) repeat units of formula (V):
- c) repeat units of formula (VI):
- and
- d) repeat units of formula (VII):
- wherein the proportions of these repeat units are the following:
- repeat units (IV):
- from 10.0 mol % to 25.0 mol %;
- repeat units (V):
- from 10.0 mol % to 30.0 mol %;
- repeat units (VI):
- from 30.0 mol % to 80.0 mol %;
- repeat units (VII):
- from 1.0 mol % to 10.0 mol %;
- these proportions in mol % being based on the total number of moles in the LCP.
15 more elements
Dependencies are inferred from the claim text.