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US 12,489,189 B2Granted
Contactless communication using a waveguide extending through a substrate core
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios C. Dogiamis, Johanna M. Swan
Life of this patent
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Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.
Claims18
A package comprising:
- a substrate with a core, the core having a first side and a second side opposite the first side;
- a metal ring extending from the first side of the core to the second side of the core;
- a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
- a buildup layer with a first side and a second side opposite the first side, wherein the second side of the buildup layer is coupled with the first side of the core;
- and
- a radiating element located in the buildup layer, the radiating element positioned above the waveguide, wherein the buildup layer is a first buildup layer and the radiating element is a first radiating element;
- and further comprising:
- a second build up layer coupled with the second side of the core;
- a second radiating element in the second build up layer positioned below the waveguide.
6 more elements
A system comprising:
- a substrate comprising:
- a substrate core, the core having a first side and a second side opposite the first side;
- a metal ring extending from the first side of the core to the second side of the core;
- a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
- and
- a buildup layer having a first side and a second side opposite the first side, the second side of the buildup layer coupled with the first side of the substrate core, wherein a radiating element is coupled with the buildup layer above the waveguide;
- and
- a die coupled with the first side of the buildup layer and electrically coupled with the radiating element, wherein the die is electrically coupled with the radiating element via a redistribution layer (RDL) within the buildup layer.
5 more elements
A package comprising:
- a substrate with a core, the core having a first side and a second side opposite the first side;
- a metal ring extending from the first side of the core to the second side of the core;
- a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
- a buildup layer with a first side and a second side opposite the first side, wherein the second side of the buildup layer is coupled with the first side of the core;
- and
- a radiating element located in the buildup layer, the radiating element positioned above the waveguide, wherein the substrate is a first substrate and wherein the radiating element is a first radiating element;
- and further comprising:
- a second substrate with a first side and a second side opposite the first side, wherein the first side of the second substrate is physically coupled with the second side of the first substrate;
- a second radiating element located on the first side of the second substrate and below the waveguide.
6 more elements
A package comprising:
- a substrate with a core, the core having a first side and a second side opposite the first side;
- a metal ring extending from the first side of the core to the second side of the core;
- a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
- a buildup layer with a first side and a second side opposite the first side, wherein the second side of the buildup layer is coupled with the first side of the core;
- a radiating element located in the buildup layer, the radiating element positioned above the waveguide;
- and
- a die coupled with the first side of the buildup layer;
- and wherein the radiating element is electrically coupled with the die.
5 more elements
A system comprising:
- a substrate comprising:
- a substrate core, the core having a first side and a second side opposite the first side;
- a metal ring extending from the first side of the core to the second side of the core;
- a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
- and
- a buildup layer having a first side and a second side opposite the first side, the second side of the buildup layer coupled with the first side of the substrate core, wherein a radiating element is coupled with the buildup layer above the waveguide;
- and
- a die coupled with the first side of the buildup layer and electrically coupled with the radiating element, wherein the radiating element is a first radiating element and the buildup layer is a first buildup layer;
- and further comprising:
- a second buildup layer having a first side and a second side opposite the first side, the first side of the second buildup layer coupled with the second side of the substrate core, wherein a second radiating element is coupled with the second buildup layer below the waveguide.
7 more elements
Dependencies are inferred from the claim text.