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US 12,489,069 B2Granted
High frequency package
AssigneeNTT, Inc.
InventorHiromasa Tanobe
Life of this patent
Estimating the term…
Abstract
A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from the mounting surface.
Claims16
A high frequency package comprising:
- a package main body including a substrate made of an insulator;
- a differential coplanar line on the substrate;
- a first signal lead pin arranged on a side of a mounting surface of the package main body, the first signal lead pin being bent such that a first end is connected to a first signal line of the differential coplanar line and a second end is apart from the mounting surface;
- a second signal lead pin arranged on the side of the mounting surface of the package main body, the second signal lead pin being bent such that a first end is connected to a second signal line of the differential coplanar line and a second end is apart from the mounting surface, and the second signal lead pin extending in a same direction as the first signal lead pin;
- and
- a ground lead pin arranged on the side of the mounting surface of the package main body, the ground lead pin being bent such that a first end is connected to a ground line of the differential coplanar line and a second end is apart from the mounting surface, and the ground lead pin extending in a same direction as the first signal lead pin,
- wherein a distance between the second end of the first signal lead pin and the second end of the second signal lead pin is different from a distance between the first end of the first signal lead pin and the first end of the second signal lead pin,
- wherein:
- the package main body comprises a metal layer to which the ground line is connected;
- and
- the metal layer includes notches around a first connecting portion between the first end of the first signal lead pin and the first signal line and a second connecting portion between the first end of the second signal lead pin and the second signal line.
8 more elements
A method comprising:
- providing a package main body including a substrate made of an insulator;
- forming a differential coplanar line on the substrate;
- arranging a first signal lead pin on a side of a mounting surface of the package main body, the first signal lead pin being bent such that a first end is connected to a first signal line of the differential coplanar line and a second end is apart from the mounting surface;
- arranging a second signal lead pin on the side of the mounting surface of the package main body, the second signal lead pin being bent such that a first end is connected to a second signal line of the differential coplanar line and a second end is apart from the mounting surface, and the second signal lead pin extending in a same direction as the first signal lead pin;
- and
- arranging a ground lead pin on the side of the mounting surface of the package main body, the ground lead pin being bent such that a first end is connected to a ground line of the differential coplanar line and a second end is apart from the mounting surface, and the ground lead pin extending in a same direction as the first signal lead pin,
- wherein a distance between the second end of the first signal lead pin and the second end of the second signal lead pin is different from a distance between the first end of the first signal lead pin and the first end of the second signal lead pin,
- wherein:
- the package main body comprises a metal layer to which the ground line is connected;
- and
- the metal layer includes notches around a first connecting portion between the first end of the first signal lead pin and the first signal line and a second connecting portion between the first end of the second signal lead pin and the second signal line.
8 more elements
Dependencies are inferred from the claim text.