Black wheels for transporting ultra-thin silicon wafer

A black wheel for transporting an ultra-thin silicon wafer, wherein the black wheel is configured to convert the ultra-thin silicon wafer from a vertical state to a horizontal state and transport the ultra-thin silicon wafer onto a horizontal conveyor belt at a next process;

• wherein the black wheel comprises grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel;
• compressed air lines are fixed onto a guard plate of the conveyor belt and respectively accommodated within the grooves;
• during a process of transporting the ultra-thin silicon wafer,
• the black wheel is configured to keep rotating such that the ultra-thin silicon wafer in the vertical state is first absorbed onto the side surface of the black wheel and then transported towards the conveyor belt;
• the grooves are configured to avoid the compressed air lines such that the black wheel, the ultra-thin silicon wafer absorbed onto the side surface of the black wheel, and the compressed air lines are not interfered with each other;
• and
• the compressed air lines are configured to blow an end of the ultra-thin silicon wafer absorbed onto the side surface of the black wheel away from the side surface when the end of the ultra-thin silicon wafer approaches the conveyor belt, such that the end of the ultra-thin silicon wafer blown away from the side surface is transported onto the conveyor belt.