Semiconductor device and method for manufacturing semiconductor device
AssigneeHamamatsu Photonics K.K.
InventorsWei Dong, Kazuyoshi Hirose
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Abstract
Provided is a semiconductor device including: a semiconductor layer having an uneven structure configured to include a recessed portion on one surface side thereof; a first electrode film (first deposited film) provided on the one surface of the semiconductor layer; and a second electrode film (second deposited film) provided on a bottom surface of the recessed portion, wherein an enlarged portion having a cross-sectional area enlarged with respect to a portion on an opening portion side of the recessed portion is provided.
Claims10
A semiconductor device comprising:
- a semiconductor layer having an uneven structure configured to include a recessed portion on one surface side thereof;
- a first deposited film provided on the one surface of the semiconductor layer;
- and
- a second deposited film provided on a bottom surface of the recessed portion,
- wherein the recessed portion is provided with an enlarged portion having a cross-sectional area enlarged with respect to a portion on an opening portion side of the recessed portion, and
- wherein a starting position of the enlarged portion is positioned between the opening portion of the recessed portion and the bottom surface of the recessed portion in a depth direction of the recessed portion.
A method for manufacturing a semiconductor device comprising:
- a processing step of forming an uneven structure including a recessed portion on one surface side of a semiconductor layer;
- and
- a deposition step of performing film formation through deposition on the one surface side of the semiconductor layer to form a first deposited film on one surface of the semiconductor layer and to form a second deposited film on a bottom surface of the recessed portion,
- wherein the processing step includes a first step performed by anisotropic etching and a second step including isotropic etching subsequent to the first step.
Dependencies are inferred from the claim text.