Grounding system, grounding component, and methods of manufacturing and using the same

A method of using a grounding system comprising a first structure having a first frame and an electrical-grounding surface at least partially exposed on the first frame, a second structure having a second frame, a plurality of conductive components each coupled to a corresponding movable coupling, and a plurality of biasing elements each mounted to bias against one of the plurality of conductive components, the method comprising:

• positioning a manufacturing part;
• positioning a manufacturing tool proximate to the manufacturing part;
• adjusting the first structure and the second structure from a first configuration, where the plurality of conductive components and the electrical-grounding surface are spaced apart, to a second configuration, where the plurality of conductive components and the electrical-grounding surface are in contact with each conductive component at least partially biased against the electrical-grounding surface by a corresponding biasing element;
• and
• processing the manufacturing part using the manufacturing tool,
• wherein each biasing element comprises one of a pair of biasing elements that bias the corresponding conductive component in opposite rotational directions about the corresponding movable coupling.

A grounding system, comprising:

• a base with an electrical-grounding surface that is at least partially exposed;
• a housing that is shiftable between a first position and a second position relative to the base;
• a plurality of movable couplings located about the housing;
• a plurality of conductive components each mounted on one of the plurality of movable couplings such that each conductive component is adjustable into different positions, wherein each conductive component is biased towards the electrical-grounding surface by multiple biasing elements coupled against a common side of the conductive component;
• wherein, when the housing is in the first position, the plurality of conductive components and the electrical-grounding surface are spaced apart, and
• wherein, when the housing is in the second position, the plurality of conductive components and the electrical-grounding surface are in contact with each conductive component at least partially biased against the electrical-grounding surface.